Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method to manufacture a universal footprint for a package with exposed chip

Method to manufacture a universal footprint for a package with exposed chip

US Patent 7256479 · Granted Aug 14, 2007

Estimated economic value: $13,937,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Plated metal layer in power packages2025
Concealed gate terminal semiconductor packages and related methods2025
Packaged electronic device with film isolated power stack2025
Multi-die package with multiple heat channels2024
Integrated magnetic assembly2024
Physical layer to link layer interface and related systems, methods and devices2024
Molded packaging for wide band gap semiconductor devices2024
HIV vaccines and methods of using2024
Semiconductor device package with clip interconnect and dual side cooling2024
Continuous adaptive data capture optimization for interface circuits2024
Double data rate (DDR) memory controller apparatus and method2024
Stacked die multichip module package2024