Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package with clip interconnect and dual side cooling

Semiconductor device package with clip interconnect and dual side cooling

US Patent 12051635 · Granted Jul 30, 2024

Estimated economic value: $63,142,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

SiC MOSFET semiconductor packages and related methods2025
SiC MOSFET semiconductor packages and related methods2025
Semiconductor packages using package in package systems and related methods2025
Concealed gate terminal semiconductor packages and related methods2025
Concealed gate terminal semiconductor packages and related methods2025
Concealed gate terminal semiconductor packages and related methods2025
Electronic device packaging with galvanic isolation2025
Submodule semiconductor package2025
Package including multiple semiconductor devices2024
Molded packaging for wide band gap semiconductor devices2024
Semiconductor packages using package in package systems and related methods2024
Concealed gate terminal semiconductor packages and related methods2023