Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit having structural support for a flip-chip interconnect pad and method therefor

Integrated circuit having structural support for a flip-chip interconnect pad and method therefor

US Patent 7247552 · Granted Jul 24, 2007

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor chip device2025
Method and device for designing low-frequency non-separable transform2025
Image decoding method and device therefor2025
Image encoding/decoding method and device using adaptive color transform, and me2025
Method and device for intra prediction based on plurality of DIMD modes2025
Image encoding/decoding method using weighted prediction, and method for transmi2025
Image coding method and device therefor2025
Image or video coding based on palette coding2025
Method for sequencing polynucleotides2025
Electronic device including dies and an interconnect coupled to the dies and pro2025
Method and device for weighted prediction for image/video coding2025
Antenna assembly and wireless device2025