Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer

Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer

US Patent 7101795 · Granted Sep 5, 2006

Estimated economic value: $12,664,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Nucleation-free gap fill ALD process2025
Method and apparatus for powder removal in an additive manufacturing system2025
Printing method for additive manufacturing, including in-situ powder regeneratio2025
Methods for the treatment of workpieces2023
Chamber seasoning to improve etch uniformity by reducing chemistry2023
Surface pretreatment process to improve quality of oxide films produced by remot2022
Ozone for selective hydrophilic surface treatment2022
Processing of workpieces with reactive species generated using alkyl halide2022
Nucleation-free gap fill ALD process2022
Methods for processing a workpiece using fluorine radicals2022
Silicon oxide selective dry etch process2022
Method and apparatuses for reducing porogen accumulation from a UV-cure chamber2021