Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process of insulating a semiconductor device using a polymeric material

Process of insulating a semiconductor device using a polymeric material

US Patent 7056837 · Granted Jun 6, 2006

Estimated economic value: $5,053,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Buried power rail at tight cell-to-cell space2025
Structure containing a via-to-buried power rail contact structure or a via-to-ba2025
Electrical connections between dissimilar materials at cryogenic temperatures2025
Edge capacitive coupling for quantum chips2025
Layered substrate structures with aligned optical access to electrical devices2024
Downstop and bump bonds formation on substrates2024
Create a protected layer for interconnects and devices in a packaged quantum str2024
Create a protected layer for interconnects and devices in a packaged quantum str2024
Interposer chips and enclosures for quantum circuits2024
Combined backing plate and housing for use in bump bonded chip assembly2023
Combined backing plate and housing for use in bump bonded chip assembly2023
Superconducting airbridge crossover using superconducting sacrificial material2022