Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › CMP process leaving no residual oxide layer or slurry particles

CMP process leaving no residual oxide layer or slurry particles

US Patent 6903019 · Granted Jun 7, 2005

Estimated economic value: $3,543,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for determining parameters of three dimensional nanostructure and apparat2025
Gate stack treatment2025
Semiconductor device and method of forming the same2025
Integrated circuit structure and method with solid phase diffusion2025
Method for driving touch panel and related touch control circuit2024
Metal loss prevention using implantation2024
Wrap around silicide for FinFETs2024
3D capacitor and method of manufacturing same2024
Method of forming source/drain regions with expanded widths2024
Systems and methods for fabricating FinFETs with different threshold voltages2024
Semiconductor structure and method of forming the same2024
Source/drain structure2024