Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High density area array solder microjoining interconnect structure and fabrication method

High density area array solder microjoining interconnect structure and fabrication method

US Patent 6819000 · Granted Nov 16, 2004

Estimated economic value: $5,414,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Buried power rail at tight cell-to-cell space2025
Structure containing a via-to-buried power rail contact structure or a via-to-ba2025
Layered substrate structures with aligned optical access to electrical devices2024
Create a protected layer for interconnects and devices in a packaged quantum str2024
Enhanced adhesive materials and processes for 3D applications2021
3D integration method using SOI substrates and structures produced thereby2020
Ionizing radiation blocking in IC chip to reduce soft errors2020
3D integration method using SOI substrates and structures produced thereby2020
Enhanced adhesive materials and processes for 3D applications2020
3D integration method using SOI substrates and structures produced thereby2020
Reduction of entropic barrier of polyelectrolyte molecules in a nanopore device 2020
Reduction of entropic barrier of polyelectrolyte molecules in a nanopore device 2020