Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › 3D integration method using SOI substrates and structures produced thereby

3D integration method using SOI substrates and structures produced thereby

US Patent 10651086 · Granted May 12, 2020

Estimated economic value: $2,725,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Three-dimensional silicon-based comb probe with optimized biocompatible dimensio2024
Nanostructure featuring nano-topography with optimized electrical and biochemica2024
Nanostructure featuring nano-topography with optimized electrical and biochemica2023
Cognitive optogenetics probe and analysis2022
Three-dimensional silicon-based comb probe2022
Neuro-chemical sensor with inhibition of fouling on nano-electrode2022
Intelligent and disposable device for selective electrical stimulation of apopto2022
Intelligent and disposable device for selective electrical stimulation of apopto2022
Enhanced adhesive materials and processes for 3D applications2021
Enhanced adhesive materials and processes for 3D applications2021
Saccade and vergence tracking for distance auto focus adjustment2021
Antibacterial medical implant surface2021