Assignee
Inventors
- David Wei (19 patents)
- Yehiel Gotkis (63 patents)
- Aleksander Owczarz (69 patents)
- John M. Boyd (135 patents)
- Rod Kistler (10 patents)
{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Apparatus for removal/remaining thickness profile manipulation", "item": "https://www.patentleaderboard.com/patent/6808442"}]}
Skip to contentUS Patent 6808442 · Granted Oct 26, 2004