Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit with bonding layer over active circuitry

Integrated circuit with bonding layer over active circuitry

US Patent 6683380 · Granted Jan 27, 2004

Estimated economic value: $41,018,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device comprising electron blocking layer2025
Reference voltage generation within a temperature range2025
Skip clamp circuit for DC-DC power converters2025
Clamping tool with display device for tightening conditions2025
Suspended semiconductor dies2024
Root mean square sensor device2024
Logarithmic amplifier circuit2022
Suspended semiconductor dies2022
System and apparatus to provide current compensation2022
Driver for transistor2022
Wireless chip-to-chip switching2022
Track and hold circuits with transformer coupled bootstrap switch2022