Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for bonding heat sinks to overmolds and device formed thereby

Method for bonding heat sinks to overmolds and device formed thereby

US Patent 6576996 · Granted Jun 10, 2003

Estimated economic value: $13,477,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit card attachment for enhanced robustness of thermal performance2022
Thermal interface adhesion for transfer molded electronic components2021
Recyclable and dispensable cutlery utensil2021
Using in situ capacitance measurements to monitor the stability of interface mat2021
No touch utensil dispenser2020
Chip package for two-phase cooling and assembly process thereof2020
Thermal interface adhesion for transfer molded electronic components2020
Using in situ capacitance measurements to monitor the stability of interface mat2019
Underfill dispensing using funnels2019
Thermal interface solution with reduced adhesion force2019
Water soluble low alpha particle emission electrically-conductive coating2019
Direct injection molded solder process for forming solder bumps on wafers2018