Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer

Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer

US Patent 6392202 · Granted May 21, 2002

Estimated economic value: $182,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resin sealing structure for electronic component and resin sealing method for el2013
Component crimping apparatus control method, component crimping apparatus, and m2011
Component mounting method, component mounting apparatus, and ultrasonic bonding 2011
Component mounting method, component mounting apparatus, and ultrasonic bonding 2011
Component mounting method, component mounting apparatus, and ultrasonic bonding 2011
Component mounting apparatus2010
Receiver for component feed plates and component feeder2010
Component mounting apparatus2010
Component mounting apparatus2010
Component feeder2010
Optical wireless communication device2010
Component supply head device and component mounting head device2010