Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › In line yield prediction using ADC determined kill ratios die health statistics and die stacking

In line yield prediction using ADC determined kill ratios die health statistics and die stacking

US Patent 6338001 · Granted Jan 8, 2002

Estimated economic value: $11,293,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Image processing in integrated circuit technology development2009
Method and apparatus for correlating semiconductor process data with known prior2007
Predicting defect future effects in integrated circuit technology development to2007
Test structure and method for failure analysis of small contacts in integrated c2006
Wafer level global bitmap characterization in integrated circuit technology deve2006
Characterizing distribution signatures in integrated circuit technology2006
Fabrication of dual work-function metal gate structure for complementary field e2006
Testing multiple levels in integrated circuit technology development2005
Fabrication of dual work-function metal gate structure for complementary field e2005
Fabrication of shallow trench isolation structures with rounded corner and self-2004
Pitch reduction using a set of offset masks2003
Methods to form reduced dimension bit-line isolation in the manufacture of non-v2003