Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same

Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same

US Patent 6282094 · Granted Aug 28, 2001

Estimated economic value: $392,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package substrate having landless conductive traces2012
Flip-chip semiconductor package and chip carrier for preventing corner delaminat2012
Method for fabricating semiconductor package2008
Method of making semiconductor package with heat spreader2007
Semiconductor package and fabrication method thereof2007
Ball grid array substrate strip with warpage-preventive linkage structure2006
Fabrication method of semiconductor package with heat sink2006
Method of fabricating a thin and fine ball-grid array package with embedded heat2006
Lead frame and semiconductor package with the same2006
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Method of fabricating a thin and fine ball-grid array package with embedded heat2005