Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

US Patent 7045395 · Granted May 16, 2006

Estimated economic value: $4,220,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for fabricating flip-chip semiconductor package with lead frame as chip c2010
Flip-chip semiconductor package with lead frame as chip carrier and fabrication 2007
Flip-chip semiconductor package with lead frame and method for fabricating the s2007
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Method of fabricating a thin and fine ball-grid array package with embedded heat2005
Flash-preventing semiconductor package2005