Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same

Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same

US Patent 6271585 · Granted Aug 7, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Board-to-board connector2025
Glass composition for glass fiber, glass fiber, glass fiber woven fabric, and gl2025
Electrical connector for attachment to textile2024
Strain distribution measurement system and strain distribution measurement metho2024
Electrical connector2024
Electrical connector2024
Electrical connector2024
Electrical connector2024
Electrical connector2024
Electrical connector2024
Electrical connector2024
Surface-colored glass cloth and fiber-reinforced resin molded product2023