Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making copper alloys for chip and package interconnections

Method of making copper alloys for chip and package interconnections

US Patent 6090710 · Granted Jul 18, 2000

Estimated economic value: $26,569,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Expansion controlled structure for direct bonding and method of forming same2025
Directly bonded metal structures having aluminum features and methods of prepari2025
Metal pads over TSV2025
Structures with through-substrate vias and methods for forming the same2025
Die processing2025
Direct bonding methods and structures2025
Techniques for processing devices2025
Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon2025
Seal for microelectronic assembly2025
Direct hybrid bonding of substrates having microelectronic components with diffe2025
Processing stacked substrates2025
Dimension compensation control for directly bonded structures2025