Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated, multi-chip, thermally conductive packaging device and methodology

Integrated, multi-chip, thermally conductive packaging device and methodology

US Patent 6075287 · Granted Jun 13, 2000

Estimated economic value: $39,484,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Low maintenance flat mail line scan camera system2010
Method of inspecting articles using imaging inspection apparatus with directiona2009
Method of making wirebond electronic package with enhanced chip pad design2009
Method of making an imaging inspection apparatus with improved cooling2009
Imaging inspection apparatus with improved cooling2008
Method and apparatus for containing mail articles deposited in a mail drop box2008
Wafer scale thin film package2008
Imaging inspection apparatus with directional cooling2007
Wirebond electronic package with enhanced chip pad design, method of making same2007
Thermally enhanced lid for multichip modules2007
Electronic package with thermally-enhanced lid2007
Method and apparatus for containing mail articles deposited in a mail drop box2007