Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chemical mechanical polishing endpoint process control

Chemical mechanical polishing endpoint process control

US Patent 5659492 · Granted Aug 19, 1997

Estimated economic value: $11,736,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Efficient execution of a decision tree2024
Uplift modeling2023
Identifying optimal weights to improve prediction accuracy in machine learning t2022
Work piece contact pad with centering feature2016
Lapping carrier2016
Lapping head with a sensor device on the rotating lapping head2016
Predicting service request breaches2015
Row bar thickness measurement device, system and methods2015
Ambient temperature ball bond2014
Combined feature creation to increase data mining signal in hybrid datasets2011
Data mining using variable rankings and enhanced visualization methods2011
Ionization test for electrical verification2010