Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ambient temperature ball bond

Ambient temperature ball bond

US Patent 8767351 · Granted Jul 1, 2014

Estimated economic value: $17,445,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Adhesive for processing a microelectronic substrate, and related methods2025
Barrier device used in the manufacture of a lapping plate, and related apparatus2023
Adhesive for processing a microelectronic substrate, and related methods2023
Method of forming one or more sliders2023
Methods of lapping while heating one or more features, and related sliders, row 2023
Transfer-printed near-field transducer and heat sink2023
Heat-assisted magnetic recording device incorporating laser heater for improved 2022
Methods of lapping while heating one or more features, and related sliders, row 2022
Lapping system that includes a lapping plate temperature control system, and rel2022
Recording head with transfer-printed laser diode unit formed of non-self-support2021
Heat-assisted magnetic recording device incorporating laser heater for improved 2021
Methods of manufacturing one or more sliders, and related sliders2021