Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reworkable polymer chip encapsulant

Reworkable polymer chip encapsulant

US Patent 5659203 · Granted Aug 19, 1997

Estimated economic value: $11,736,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Coolant-cooled heat sink(s) with associated ultra-violet light assembly2024
High power device fault localization via die surface contouring2024
Multi chip hardware security module2024
Mitigating moisture-driven degradation of features designed to prevent structura2023
Ultrasonic-assisted solder transfer2023
Fixture facilitating heat sink fabrication2022
Laminated stiffener to control the warpage of electronic chip carriers2022
Combination polyimide decal with a rigid mold2022
Hybrid TIMs for electronic package cooling2022
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the 2021
Conformal integrated circuit (IC) device package lid2021
Localized catalyst for enhanced thermal interface material heat transfer2021