Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for cooling of chips using a plurality of materials

Method for cooling of chips using a plurality of materials

US Patent 5604978 · Granted Feb 25, 1997

Estimated economic value: $16,631,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Salt bath compositions and methods for regenerating salt bath compositions2025
Multi chip hardware security module2024
Chemically strengthened lithium disilicate-petalite glass-ceramics2023
Etching glass and glass ceramic materials in hydroxide containing molten salt2023
Mitigating moisture-driven degradation of features designed to prevent structura2023
Laminated stiffener to control the warpage of electronic chip carriers2022
Hybrid TIMs for electronic package cooling2022
System and method to exchange identity governance data across multiple identity 2022
Conformal integrated circuit (IC) device package lid2021
Localized catalyst for enhanced thermal interface material heat transfer2021
Chemically strengthened lithium disilicate-petalite glass-ceramics2021
Mitigating moisture-driven degradation of features designed to prevent structura2021