Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for braze attachment of electronic package members

Process for braze attachment of electronic package members

US Patent 4824009 · Granted Apr 25, 1989

Estimated economic value: $21,550,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Graphic formation via material ablation2017
Electronic device with plated electrical contact2017
Metal alloy injection molding2015
Metal alloy injection molding overflows2015
Metal alloy injection molding protrusions2015
Metal alloy injection molding protrusions2014
Integrated circuit socket2012
Void reduction in indium thermal interface material2011
Semiconductor chip with solder joint protection ring2011
Method for decreasing surface delamination of gel-type thermal interface materia2010
Semiconductor device with gel-type thermal interface material2010
Void reduction in indium thermal interface material2010