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Home › Method for tailoring oxygen precipitate particle density and distribution silicon wafers

Method for tailoring oxygen precipitate particle density and distribution silicon wafers

US Patent 4437922 · Granted Mar 20, 1984

Estimated economic value: $18,183,000 ⓘ

Assignee

IBM

Inventors

Bernard K. Bischoff (1 patents)
William J. Patrick (6 patents)
Thomas H. Strudwick (3 patents)

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