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Home › Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias

Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias

US Patent 4789648 · Granted Dec 6, 1988

Estimated economic value: $14,999,000 ⓘ

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