{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for vacuum vapor deposition with improved mass flow control", "item": "https://www.patentleaderboard.com/patent/4717596"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for vacuum vapor deposition with improved mass flow control

Method for vacuum vapor deposition with improved mass flow control

US Patent 4717596 · Granted Jan 5, 1988

Estimated economic value: $34,804,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Efficient execution of a decision tree2024
Uplift modeling2023
Identifying optimal weights to improve prediction accuracy in machine learning t2022
Predicting service request breaches2015
Combined feature creation to increase data mining signal in hybrid datasets2011
Data mining using variable rankings and enhanced visualization methods2011
Methods of fabricating optimization involving process sequence analysis2009
Enhanced endpoint detection for wet etch process control2006
Apparatus for detecting CMP endpoint in acidic slurries2005
Method for detecting CMP endpoint in acidic slurries2005
Low defect pre-emitter and pre-base oxide etch for bipolar transistors and relat2005
Enhanced endpoint detection for wet etch process control2005