Package assembly lid and methods for forming the same

Assignee

• TSMC

Inventors

• Yu-Sheng Lin (129 patents)
• Shu-Shen Yeh (129 patents)
• Chien-Shen Chen (3 patents)
• Po-Yao Lin (210 patents)
• Shin-Puu Jeng (715 patents)
• Ming-Chih Yew (118 patents)
• Chin-Hua Wang (86 patents)
• Po-Chen Lai (51 patents)
• Chia-Kuei Hsu (54 patents)

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