Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dual metal wrap-around contacts for semiconductor devices

Dual metal wrap-around contacts for semiconductor devices

US Patent 12284820 · Granted Apr 22, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Atomic layer deposition of aluminum oxide films for semiconductor devices using 2025
Thermal etching of ruthenium2025
Method of conductive material deposition2025
Conductive superlattice structures and methods of forming the same2025
Self-aligned method for vertical recess for 3D device integration2025
Method of forming a FET structure by selective deposition of film on source/drai2025
Method for filling recessed features in semiconductor devices with a low-resisti2025
Method for threshold voltage tuning through selective deposition of high-k metal2024
Architecture design and process for manufacturing monolithically integrated 3D C2024
Method for mitigating lateral film growth in area selective deposition2023
Substrate processing tool with integrated metrology and method of using2023
Fully self-aligned via with selective bilayer dielectric regrowth2023