Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for filling recessed features in semiconductor devices with a low-resistivity metal

Method for filling recessed features in semiconductor devices with a low-resistivity metal

US Patent 12237216 · Granted Feb 25, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and structures for increasing stability of soft or organic features2025
Thermal etching of ruthenium2025
Thermal etching of ruthenium2025
Thermal etching of ruthenium2025
Wet etch process and methods to form air gaps between metal interconnects2025
Automatic animal feeding system for presenting and securing food pods2025
Automatic animal feeding system for self disposing of used food pods2025
Double hardmasks for self-aligned multi-patterning processes2025
Double patterning method of patterning a substrate2025
Metal hard mask integration2025
Ultra-shallow dopant and ohmic contact regions by solid state diffusion2025
Method of conductive material deposition2025