Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package and methods of manufacture

Semiconductor device package and methods of manufacture

US Patent 11978720 · Granted May 7, 2024

Estimated economic value: $17,992,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Die bonding tool with tiltable bond head for improved bonding and methods for pe2025
Semiconductor device and method of forming the same2025
Heterogeneous bonding structure and method forming same2025
Inverted trapezoidal heat dissipating solder structure and method of making the 2025
Bump structure and method of manufacturing bump structure2025
Chip structure and method for forming the same2025
Chip structure and method for forming the same2025
Redistribution lines having nano columns and method forming same2025
Package structures2025
Test structures to determine integrated circuit bonding energies and methods of 2025
Package bonding structures and method of formation2025
Package bonding structures and method of formation2025