Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Advanced info POP and method of forming thereof

Advanced info POP and method of forming thereof

US Patent 11955460 · Granted Apr 9, 2024

Estimated economic value: $14,186,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package with electrically conductive structure and manufacturing m2025
Method of fabricating memory device and package structure2025
Method of fabricating memory device and package structure2025
Method of fabricating memory device and package structure2025
Semiconductor package and manufacturing method of the same2025
Semiconductor device and method of forming the same2025
Heterogeneous bonding structure and method forming same2025
Inverted trapezoidal heat dissipating solder structure and method of making the 2025
Bump structure and method of manufacturing bump structure2025
Chip structure and method for forming the same2025
Redistribution lines having nano columns and method forming same2025
Package bonding structures and method of formation2025