{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Giga interposer integration through chip-on-wafer-on-substrate", "item": "https://www.patentleaderboard.com/patent/11728254"}]}
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Giga interposer integration through chip-on-wafer-on-substrate

US Patent 11728254 · Granted Aug 15, 2023

Estimated economic value: $5,717,000

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