Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through silicon via design for stacking integrated circuits

Through silicon via design for stacking integrated circuits

US Patent 11705449 · Granted Jul 18, 2023

Estimated economic value: $10,411,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including germanium region disposed in semiconductor substr2025
Semiconductor device2025
Semiconductor device2025
Semiconductor device2025
Semiconductor device2025
Image sensor having an improved structure for small pixel designs2025
Stacked structure for CMOS image sensors2025
Stacked integrated circuits with redistribution lines2025
3DIC interconnect apparatus and method2025
Crank apparatus equipped with labor-saving mechanism and bicycle crank assembly2025
Control chip and control method thereof2025
Multi-function substrate2025