Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414361 | Method of manufacturing a semiconductor device | Kong-Beng Thei, Fu-Jier Fan, Jung-Hui Kao, Yi-Huan Chen, Kau-Chu Lin | 2025-09-09 |
| 11956917 | Tray for expansion device and server having same | Si-Yun Tan | 2024-04-09 |
| 11705449 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2023-07-18 |
| 11646308 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2023-05-09 |
| 11569363 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei +1 more | 2023-01-31 |
| 11417649 | Semiconductor device | Kong-Beng Thei, Fu-Jier Fan, Jung-Hui Kao, Yi-Huan Chen, Kau-Chu Lin | 2022-08-16 |
| 11302691 | High voltage integration for HKMG technology | Kong-Beng Thei, Chien-Chih Chou, Fu-Jier Fan, Hsiao-Chin Tuan, Yi-Huan Chen +1 more | 2022-04-12 |
| 11063038 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2021-07-13 |
| D922499 | 3D puzzle toy | — | 2021-06-15 |
| D922500 | 3D puzzle toy | — | 2021-06-15 |
| D921768 | 3D puzzle toy | — | 2021-06-08 |
| D921769 | 3D puzzle toy | — | 2021-06-08 |
| 11004844 | Recessed STI as the gate dielectric of HV device | Yi-Huan Chen, Kong-Beng Thei, Fu-Jier Fan, Ker Hsiao Huo, Kau-Chu Lin +2 more | 2021-05-11 |
| 10964692 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2021-03-30 |
| 10950708 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei +1 more | 2021-03-16 |
| 10937785 | Semiconductor device | Kong-Beng Thei, Fu-Jier Fan, Jung-Hui Kao, Yi-Huan Chen, Kau-Chu Lin | 2021-03-02 |
| 10916542 | Recessed STI as the gate dielectric of HV device | Yi-Huan Chen, Kong-Beng Thei, Fu-Jier Fan, Ker Hsiao Huo, Kau-Chu Lin +2 more | 2021-02-09 |
| 10790279 | High voltage integration for HKMG technology | Kong-Beng Thei, Chien-Chih Chou, Fu-Jier Fan, Hsiao-Chin Tuan, Yi-Huan Chen +1 more | 2020-09-29 |
| 10629592 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2020-04-21 |
| 10516029 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei +1 more | 2019-12-24 |
| 10510750 | High voltage integration for HKMG technology | Kong-Beng Thei, Chien-Chih Chou, Fu-Jier Fan, Hsiao-Chin Tuan, Yi-Huan Chen +1 more | 2019-12-17 |
| 10461601 | Motor with an improved damp proof or dustproof effect | Alex Horng, Sheng-Chieh Liang | 2019-10-29 |
| 10340357 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei +1 more | 2019-07-02 |
| 10050033 | High voltage integration for HKMG technology | Kong-Beng Thei, Chien-Chih Chou, Fu-Jier Fan, Hsiao-Chin Tuan, Yi-Huan Chen +1 more | 2018-08-14 |
| 9874919 | Soft switching control after power interruption | Maw-Zan Jau, Shu-Chen Ni, Chin-Hsiang Chan, Chih-Chang Tsai | 2018-01-23 |