Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Carrier based high volume system level testing of devices with pop structures

Carrier based high volume system level testing of devices with pop structures

US Patent 11587640 · Granted Feb 21, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Tension-based socket gimbal for engaging device under test with thermal array2025
Tension-based socket gimbal for engaging device under test with thermal array2025
Tension-based socket gimbal for engaging device under test with thermal array2025
Carrier based high volume system level testing of devices with pop structures2025
Carrier based high volume system level testing of devices with pop structures2025
Carrier based high volume system level testing of devices with pop structures2025
Carrier based high volume system level testing of devices with pop structures2025
Carrier based high volume system level testing of devices with pop structures2025
Integrated test cell using active thermal interposer (ATI) with parallel socket 2025
Integrated test cell using active thermal interposer (ATI) with parallel socket 2025
Integrated test cell using active thermal interposer (ATI) with parallel socket 2025
Integrated test cell using active thermal interposer (ATI) with parallel socket 2025