Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor structure and method for forming the same

Semiconductor structure and method for forming the same

US Patent 11094655 · Granted Aug 17, 2021

Estimated economic value: $12,898,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming the same2025
Heterogeneous bonding structure and method forming same2025
Inverted trapezoidal heat dissipating solder structure and method of making the 2025
Inverted trapezoidal heat dissipating solder structure and method of making the 2025
Bump structure and method of manufacturing bump structure2025
Chip structure and method for forming the same2025
Chip structure and method for forming the same2025
Redistribution lines having nano columns and method forming same2025
Package bonding structures and method of formation2025
Redistribution lines with protection layers and method forming same2025
Bump structure and method of making the same2025
Bump structure and method of making the same2025