Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package, semiconductor device and method for packaging semiconductor device

Semiconductor package, semiconductor device and method for packaging semiconductor device

US Patent 10867882 · Granted Dec 15, 2020

Estimated economic value: $3,031,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package, package structure and method of manufacturing the same2025
Multi-liner TSV structure and method forming same2025
Semiconductor structure and method manufacturing the same2025
Semiconductor structure and manufacturing method thereof2025
Conductive traces in semiconductor devices and methods of forming same2025
Conductive traces in semiconductor devices and methods of forming same2025
Conductive traces in semiconductor devices and methods of forming same2025
Package structure and manufacturing method thereof2025
Package structure and manufacturing method thereof2025
Semiconductor package and manufacturing method thereof2025
Dielectric slots underneath conductive vias in interconnect structure of semicon2025
Package2025