Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High-density chip-to-chip interconnection with silicon bridge

High-density chip-to-chip interconnection with silicon bridge

US Patent 10784202 · Granted Sep 22, 2020

Estimated economic value: $3,040,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multicomponent module design and fabrication2025
Multicomponent module design and fabrication2025
Direct bonded heterogeneous integration silicon bridge2023
Direct bonded heterogeneous integration silicon bridge2023
Thin film capacitors for core and adjacent build up layers2022
High-bandwidth embedded optical connector with latching mechanism2022
Photonics package with face-to-face bonding2021
Photonics package with face-to-face bonding2021
Direct bonded heterogeneous integration packaging structures2021
Mixed under bump metallurgy (UBM) interconnect bridge structure2021
Mixed under bump metallurgy (UBM) interconnect bridge structure2021
Mixed under bump metallurgy (UBM) interconnect bridge structure2021