Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof

Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof

US Patent 10269678 · Granted Apr 23, 2019

Estimated economic value: $25,177,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of fabricating substrates with thermal vias and sinter-bonded thermal di2025
Power amplifier modules including topside cooling interfaces and methods for the2025
Power amplifier modules including topside cooling interfaces and methods for the2025
Low-stress thermal interface2025
Low-stress thermal interface2025
Power amplifier modules, systems, and substrates containing field trapper struct2025
Display module and display device2025
Enabling an efficient understanding of contents of a large document without stru2025
Dynamic visual tagging system for search2025
On-demand image layer retrieval2025
Damping system for hydraulic coupling device, hydraulic coupling device and moto2025
Dynamically controlling foreground applications during screen sharing conference2025