YN

Yoshirou Nakata

PA Panasonic: 7 patents #3,841 of 21,108Top 20%
Sumitomo Electric Industries: 5 patents #5,365 of 21,551Top 25%
AD Advantest: 1 patents #714 of 1,193Top 60%
📍 Nara, JP: #368 of 2,795 inventorsTop 15%
Overall (All Time): #421,131 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
8659312 Probe card and semiconductor wafer inspection method using the same Naomi Miyake 2014-02-25
8638118 Wafer inspection device Satoshi Sasaki 2014-01-28
8598902 Probe, electronic device test apparatus, and method of producing the same Yoshiharu Umemura, Kensuke Kato, Naomi Miyake 2013-12-03
8400182 Wafer inspection device and semiconductor wafer inspection method using the same Satoshi Sasaki 2013-03-19
7982482 Probe card, method of manufacturing the probe card and alignment method Kenji Yamada 2011-07-19
7768285 Probe card for semiconductor IC test and method of manufacturing the same Minoru Sanada 2010-08-03
7673205 Semiconductor IC and testing method thereof Naomi Miyake 2010-03-02
7589543 Probe card having a conductive thin film on the surface of an insulating film behind each of the alignment marks each marks comprises a plurality of second bumps Kenji Yamada 2009-09-15
7170189 Semiconductor wafer and testing method therefor Masao Takahashi, Tadaaki Mimura, Toshihiko Sakashita, Toshiyuki Fukuda 2007-01-30
6323663 Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method Toshio Yamada, Atsushi Fujiwara, Isao Miyanaga, Shin Hashimoto, Yukiharu Uraoka +2 more 2001-11-27
6005401 Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method Toshio Yamada, Atsushi Fujiwara, Isao Miyanaga, Shin Hashimoto, Yukiharu Uraoka +2 more 1999-12-21
5945834 Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method Toshio Yamada, Atsushi Fujiwara, Isao Miyanaga, Shin Hashimoto, Yukiharu Uraoka +2 more 1999-08-31