MN

Makoto Nagashima

PA Panasonic: 10 patents #2,582 of 21,108Top 15%
4P 4D-S Pty: 7 patents #1 of 4Top 25%
Applied Materials: 5 patents #2,165 of 7,310Top 30%
NA Nabtesco: 4 patents #32 of 320Top 10%
US US Dept of Health & Human Services: 3 patents #364 of 3,044Top 15%
US Unity Semiconductor: 2 patents #31 of 55Top 60%
4D 4D-S: 2 patents #2 of 9Top 25%
TK Toshin Seiko Kabushiki Kaisha: 1 patents #6 of 17Top 40%
📍 Kyoto, MD: #2 of 11 inventorsTop 20%
Overall (All Time): #67,045 of 4,157,543Top 2%
44
Patents All Time

Issued Patents All Time

Showing 26–44 of 44 patents

Patent #TitleCo-InventorsDate
8067563 Tumor suppressor gene, p471NG3 Curtis C. Harris 2011-11-29
8026350 Tumor suppressor gene, p28ING5 Curtis C. Harris, Remy Pedeux, Masayuki Shiseki 2011-09-27
7932548 Systems and methods for fabricating self-aligned memory cell 2011-04-26
7919590 Tumor suppressor gene P33ING2 Curtis C. Harris 2011-04-05
7709609 Tumor suppressor gene, p47ING3 Curtis C. Harris 2010-05-04
7432349 Tumor suppressor gene, p28ING5 Curtis C. Harris, Remy Pedeux, Masayuki Shiseki 2008-10-07
7431926 Tumor supressor gene p33ING2 Curtis C. Harris 2008-10-07
7425504 Systems and methods for plasma etching Dominik Schmidt 2008-09-16
7335749 Tumor suppressor gene, p47Ing3 Curtis C. Harris 2008-02-26
7309616 Laser annealing of complex metal oxides (CMO) memory materials for non-volatile memory integrated circuits Darrell Rinerson, Steve Kuo-Ren Hisa 2007-12-18
7063984 Low temperature deposition of complex metal oxides (CMO) memory materials for non-volatile memory integrated circuits Darrell Rinerson, Steve Kuo-Ren Hsia, Larry Matheny 2006-06-20
6962648 Back-biased face target sputtering Dominik Schmidt 2005-11-08
6790948 Tumor suppressor gene p33ING2 Curtis C. Harris 2004-09-14
5419924 Chemical vapor deposition method and apparatus therefore Hiroshi Nishizato, Hirofumi Ono 1995-05-30
5354387 Boron phosphorus silicate glass composite layer on semiconductor wafer Peter Wai-Man Lee, David N. Wang, Kazuto Fukuma, Tetsuya Sato 1994-10-11
5314845 Two step process for forming void-free oxide layer over stepped surface of semiconductor wafer Peter Wai-Man Lee, David N. Wang, Kazuto Fukuma, Tatsuya Sato 1994-05-24
5166101 Method for forming a boron phosphorus silicate glass composite layer on a semiconductor wafer Peter Wai-Man Lee, David N. Wang, Kazuto Fukuma, Tetsuya Sato 1992-11-24
5129958 Cleaning method for semiconductor wafer processing apparatus Naoaki Kobayashi, Jerry Wong 1992-07-14
4184800 Steel shape stacking apparatus Tsutomu Uchida, Zenichi Ono, Eiji Tasaka, Shigeo Mitsui, Keiichi Nomura 1980-01-22