KH

Kiyoshi Hasegawa

Nissan Motor Co.: 17 patents #316 of 8,689Top 4%
HC Hitachi Chemical Company: 12 patents #116 of 1,946Top 6%
OC Oki Electric Industry Co.: 7 patents #247 of 2,807Top 9%
SN Sii Nanotechnology: 5 patents #29 of 157Top 20%
HI Hitachi: 5 patents #7,555 of 28,497Top 30%
SI Seiko Instruments: 5 patents #328 of 1,437Top 25%
SO Sony: 4 patents #8,966 of 25,231Top 40%
HC Hitachi Ulsi Systems Co.: 4 patents #214 of 867Top 25%
KT Kabushiki Kaisha Toshiba: 2 patents #9,982 of 21,451Top 50%
Mitsubishi Electric: 2 patents #11,187 of 25,717Top 45%
JC Japan Servo Co.: 2 patents #48 of 161Top 30%
RC Rheon Automatic Machinery Co.: 2 patents #35 of 90Top 40%
Sumitomo Electric Industries: 2 patents #9,741 of 21,551Top 50%
SS Sumitomo Wiring Systems: 2 patents #1,192 of 2,615Top 50%
AT Autonetworks Technologies: 2 patents #557 of 1,079Top 55%
YE Yokogawa Electric: 1 patents #658 of 1,441Top 50%
SA Samco: 1 patents #4 of 16Top 25%
Honda Motor Co.: 1 patents #12,035 of 21,052Top 60%
Shimano: 1 patents #486 of 759Top 65%
NC Nippon Seiko Co.: 1 patents #121 of 315Top 40%
KS Kobe Steel: 1 patents #857 of 2,031Top 45%
HS Hitachi High-Tech Science: 1 patents #94 of 167Top 60%
OC Oriental Yeast Co.: 1 patents #45 of 160Top 30%
RT Renesas Technology: 1 patents #1,991 of 3,337Top 60%
Overall (All Time): #23,210 of 4,157,543Top 1%
79
Patents All Time

Issued Patents All Time

Showing 26–50 of 79 patents

Patent #TitleCo-InventorsDate
8172625 Spherical terminal with guide groove Tomokazu Kashiwada, Sho Miyazaki, Shiro Nishida, Masaharu Suetani 2012-05-08
8167653 Shield shell Sho Miyazaki, Fujio Sonoda 2012-05-01
7964289 Formation method of metal layer on resin layer, printed wiring board, and production method thereof Kenji Takai, Norio Moriike, Kenichi Kamiyama, Katsuyuki Masuda 2011-06-21
7862889 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa +2 more 2011-01-04
7818877 Formation method of metal layer on resin layer Kenji Takai, Norio Moriike, Kenichi Kamiyama, Katsuyuki Masuda 2010-10-26
7794306 Surface finishing apparatus and related method Tomohiro Kondo, Masahiko Iizumi, Masahiro Omata, Takashi Ogino, Takafumi Watanabe +3 more 2010-09-14
7629045 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa +2 more 2009-12-08
7615277 Formation method of metal layer on resin layer, printed wiring board, and production method thereof Kenji Takai, Norio Moriike, Kenichi Kamiyama, Katsuyuki Masuda 2009-11-10
7587025 X-ray analysis apparatus and X-ray analysis method Takayuki Fukai, Yoshiki Matoba 2009-09-08
7529337 Energy dispersion type radiation detecting system and method of measuring content of object element Yoshiki Matoba, Takayuki Fukai 2009-05-05
7436077 Semiconductor device and method of manufacturing the same 2008-10-14
7413498 Lapping apparatus and lapping method Masahiro Omata, Masahiko Iizumi, Takashi Ogino, Tomohiro Kondo, Kazuo Takeda +3 more 2008-08-19
7153119 Apparatus for extruding food dough Shigeru Hashimoto 2006-12-26
7062014 X-ray analyzer for analyzing plastics 2006-06-13
7033245 Lapping apparatus and lapping method Masahiko Iizumi, Masahiro Omata, Takashi Ogino, Tomohiro Kondo, Kazuo Takeda +3 more 2006-04-25
6975039 Method of forming a ball grid array package Fumihiko Ooka 2005-12-13
6879188 Semiconductor integrated circuit device Masayuki Miyazaki, Ken Tatezawa, Kiwamu Takada, Kunio Uchiyama, Osamu Nishii +2 more 2005-04-12
6811828 Electroless gold plating solution and method for electroless plating Akio Takahashi, Hiroshi Yamamoto, Sumiko Nakajima, Kanji Murakami 2004-11-02
6746173 Universal joint Masashi Ochiai, Seiji Kojima 2004-06-08
6677219 Method of forming a ball grid array package Fumihiko Ooka 2004-01-13
6624008 Semiconductor chip installing tape, semiconductor device and a method for fabricating thereof 2003-09-23
6622685 Prespray processed cylinder inside and cylinder inside prespray processing method Hideo Takahashi, Minoru Chuubachi 2003-09-23
6584169 X-ray mapping analysis method 2003-06-24
6580152 Semiconductor with plural side faces 2003-06-17
6518655 Multi-chip package-type semiconductor device Yuichi Morinaga, Kenji Fuchinoue 2003-02-11