Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12158736 | Electronic apparatus activation control apparatus, electronic apparatus activation control system, electronic apparatus activation control method, and program | Masaharu Yoshino | 2024-12-03 |
| 12138434 | Puncture needle and catheter assembly | Masahiko Nagasawa | 2024-11-12 |
| 11517667 | Puncture needle | Kosuke OSAWA, Masahiko Nagasawa | 2022-12-06 |
| 11033691 | Medical puncture needle | — | 2021-06-15 |
| 10772660 | Medical puncture needle and method for manufacturing puncture needle | — | 2020-09-15 |
| 10722264 | Medical puncture needle and method for manufacturing puncture needle | — | 2020-07-28 |
| 10682473 | Medical puncture needle and method for manufacturing puncture needle | — | 2020-06-16 |
| 10429402 | Washing/drying apparatus, screening apparatus, washing/drying method, and screening method | Tadao ISAMI, Muneki Hamashima | 2019-10-01 |
| 9031687 | Method for predicting worked shape, method for determining working conditions, working method, working system, semiconductor device manufacturing method, computer program and computer program storage medium | Tatsuya Senga, Akira Ishikawa | 2015-05-12 |
| 7981309 | Method for detecting polishing end in CMP polishing device, CMP polishing device, and semiconductor device manufacturing method | Hosei Nakahira, Akira Ishikawa | 2011-07-19 |
| 7686673 | Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium | Tatsuya Senga, Akira Ishikawa | 2010-03-30 |
| 7169016 | Chemical mechanical polishing end point detection apparatus and method | Andrew H. Barada | 2007-01-30 |
| 7052920 | Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same | Yoshijiro Ushio | 2006-05-30 |
| 6963407 | Process end point detection apparatus and method, polishing apparatus, semiconductor device manufacturing method, and recording medium recorded with signal processing program | Hiroyuki Abe | 2005-11-08 |
| 6670200 | Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same | Yoshijiro Ushio | 2003-12-30 |
| 6556179 | Display device and camera having the display device | Toru Iwane, Toshimi Watanabe, Itaru Homma | 2003-04-29 |
| 6492665 | Semiconductor device | Susumu Akamatsu, Toshitaka Hibi, Tadami Shimizu, Yoshiaki Kato, Tatsuya Obata +1 more | 2002-12-10 |
| 6489624 | Apparatus and methods for detecting thickness of a patterned layer | Yoshijiro Ushio, Eiji Matsukawa, Motoo Koyama | 2002-12-03 |
| 6271047 | Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same | Yoshijiro Ushio | 2001-08-07 |
| 6180472 | Method for fabricating semiconductor device | Susumu Akamatsu, Toshitaka Hibi, Tadami Shimizu, Yoshiaki Kato, Tatsuya Obata +1 more | 2001-01-30 |
| 6051444 | Method of manufacture of liquid crystal display device having characteristics which differ locally | Toshimi Watanabe, Toru Iwane, Itaru Homma | 2000-04-18 |
| 5933181 | Photographic recording apparatus | Yukihiko Shimizu, Kinya Ueda, Yoshijiro Ushio, Masahiro Furuta | 1999-08-03 |
| 5486993 | Controlling apparatus for high frequency high voltage power source for corona discharge processing | Yukihira Sakurai | 1996-01-23 |
| 4789624 | Silver halide color photographic light-sensitive material | Kei Sakanoue, Shigeo Hirano, Keiichi Adachi | 1988-12-06 |
| 4476219 | Silver halide color photographic material | Kei Sakanoue, Shigeo Hirano, Keiichi Adachi | 1984-10-09 |