YK

Yuji Katsuda

NI Ngk Insulators: 82 patents #9 of 2,083Top 1%
NT Nagoya Institute Of Technology: 2 patents #16 of 159Top 15%
NT Nagaoka University Of Technology: 1 patents #15 of 81Top 20%
Overall (All Time): #21,432 of 4,157,543Top 1%
82
Patents All Time

Issued Patents All Time

Showing 26–50 of 82 patents

Patent #TitleCo-InventorsDate
9481813 Bonding material composition, aluminum nitride bonded body, and method for producing the same Masashi Goto, Noboru Nishimura 2016-11-01
9475733 Ceramic material and sputtering target member Yosuke Sato, Yoshinori Isoda 2016-10-25
9437463 Heating device Nobuyuki Kondo, Morimichi Watanabe, Asumi Jindo, Yosuke Sato, Yoshinori Isoda 2016-09-06
9409824 Ceramic material and sputtering target member Yosuke Sato, Yoshinori Isoda 2016-08-09
9287144 Heating device Nobuyuki Kondo, Morimichi Watanabe, Asumi Jindo, Yosuke Sato, Yoshinori Isoda 2016-03-15
9255747 Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatus Asumi Jindo, Katsuhiro Inoue, Takashi Kataigi, Shingo Amano, Hiroya SUGIMOTO 2016-02-09
9257315 Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatus Asumi Jindo, Katsuhiro Inoue, Takashi Kataigi, Shingo Amano, Hiroya SUGIMOTO 2016-02-09
9257210 Lanthanum boride sintered body and method for producing the same Tetsuya Hattori 2016-02-09
9245775 Heating device Nobuyuki Kondo, Morimichi Watanabe, Asumi Jindo, Yosuke Sato, Yoshinori Isoda 2016-01-26
9202718 Electrostatic chuck Kenichiro AIKAWA, Morimichi Watanabe, Asumi Jindo, Yosuke Sato, Yoshinori Isoda 2015-12-01
9188397 Dense composite material, method for producing the same, and component for semiconductor production equipment Asumi Jindo, Katsuhiro Inoue 2015-11-17
9184081 Electrostatic chuck Kenichiro AIKAWA, Morimichi Watanabe, Asumi Jindo, Yosuke Sato, Yoshinori Isoda 2015-11-10
9184070 Dense composite material, method for manufacturing the same, joined body, and member for semiconductor manufacturing apparatuses Asumi Jindo, Katsuhiro Inoue 2015-11-10
9142439 Laminated structure, member for semiconductor manufacturing apparatus, and method for producing laminated structure Asumi Jindo, Katsuhiro Inoue 2015-09-22
9073789 Sintered ceramic body, manufacturing method thereof, and ceramic structure Yunie Izumi, Yoshimasa Kobayashi 2015-07-07
8908349 Member for semiconductor manufacturing apparatus Masahiro Kida, Toru Hayase 2014-12-09
8685313 Corrosion-resistant member for semiconductor manufacturing apparatus and method for manufacturing the same Morimichi Watanabe, Toru Hayase 2014-04-01
8679998 Corrosion-resistant member for semiconductor manufacturing apparatus and method for manufacturing the same Morimichi Watanabe, Toru Hayase, Asumi Jindo 2014-03-25
8603625 Sintered ceramic body, manufacturing method thereof, and ceramic structure Yunie Izumi, Yoshimasa Kobayashi 2013-12-10
8597776 Ceramic material, laminate, member for use in semiconductor manufacturing equipment, and sputtering target member Morimichi Watanabe, Asumi Jindo, Yosuke Sato, Yoshinori Isoda 2013-12-03
8541328 Ceramic material, member for semiconductor manufacturing equipment, sputtering target member and method for producing ceramic material Morimichi Watanabe, Asumi Jindo, Yosuke Sato, Yoshinori Isoda 2013-09-24
8236722 Aluminum oxide sintered product and method for producing the same Naomi Teratani, Yoshimasa Kobayashi 2012-08-07
8231964 Aluminum oxide sintered body, method for producing the same and member for semiconductor producing apparatus Naomi Teratani 2012-07-31
8231985 Aluminum-nitride-based composite material, method for manufacturing the same, and member for a semiconductor manufacturing apparatus Yoshimasa Kobayashi, Akira Goto, Naohito Yamada 2012-07-31
8226865 Aluminum-nitride-based composite material, method for manufacturing the same, and member for a semiconductor manufacturing apparatus Yoshimasa Kobayashi, Akira Goto, Naohito Yamada 2012-07-24