Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9779992 | Semiconductor device and method of manufacturing the same | Ryohei Kitao | 2017-10-03 |
| 9275935 | Semiconductor device and method of manufacturing the same | Ryohei Kitao | 2016-03-01 |
| 8512540 | Plating process and manufacturing process for semiconductor device thereby | Akira Furuya | 2013-08-20 |
| 8329584 | Method of manufacturing semiconductor device | Toshiyuki Takewaki, Manabu Iguchi, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi +6 more | 2012-12-11 |
| 7955980 | Method of manufacturing semiconductor device | Toshiyuki Takewaki, Manabu Iguchi, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi +6 more | 2011-06-07 |
| 7601640 | Method of manfacturing semiconductor device | Toshiyuki Takewaki, Manabu Iguchi, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi +6 more | 2009-10-13 |
| 7229570 | Slurry for chemical mechanical polishing | Toshiji Taiji, Tomoyuki Ito, Kenichi Aoyagi, Shin Sakurai | 2007-06-12 |
| 7091123 | Method of forming metal wiring line including using a first insulating film as a stopper film | Takashi TONEGAWA, Tomoko Inoue | 2006-08-15 |
| 7067427 | Manufacturing method of semiconductor device | Tomoko Inoue | 2006-06-27 |
| 6951512 | Chemical mechanical polishing apparatus and method of chemical mechanical polishing | Mieko Suzuki | 2005-10-04 |
| 6930037 | Process for forming a metal interconnect | Tomoko Wake | 2005-08-16 |
| 6831014 | Method of manufacturing a semiconductor apparatus using chemical mechanical polishing | — | 2004-12-14 |
| 6783446 | Chemical mechanical polishing apparatus and method of chemical mechanical polishing | Mieko Suzuki | 2004-08-31 |
| 6723626 | Method of manufacturing semiconductor device | Akira Kubo | 2004-04-20 |
| 6585568 | Chemical mechanical polishing slurry | Tomoko Wake, Tetsuyuki Itakura, Shin Sakurai, Kenichi Aoyagi | 2003-07-01 |
| 6585786 | Slurry for chemical mechanical polishing | Tomoko Wake, Tetsuyuki Itakura, Shin Sakurai, Kenichi Aoyagi | 2003-07-01 |
| 6530968 | Chemical mechanical polishing slurry | Tomoko Wake, Tetsuyuki Itakura, Shin Sakurai, Kenichi Aoyagi | 2003-03-11 |
| 6478834 | Slurry for chemical mechanical polishing | Tomoko Wake, Tetsuyuki Itakura, Shin Sakurai, Kenichi Aoyagi | 2002-11-12 |
| 6443807 | Polishing process for use in method of fabricating semiconductor device | Tetsuya Sakai | 2002-09-03 |
| 6436811 | Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurry | Tomoko Wake | 2002-08-20 |
| 6428405 | Abrasive pad and polishing method | — | 2002-08-06 |
| 6368981 | Method of manufacturing semiconductor device and chemical mechanical polishing apparatus | Kazumi Sugai | 2002-04-09 |
| 6350186 | Apparatus and method for chemical mechanical polishing | — | 2002-02-26 |
| 6235071 | Chemical mechanical polishing method for highly accurate in-plane uniformity in polishing rate over position | Mieko Suzuki | 2001-05-22 |
| 6225217 | Method of manufacturing semiconductor device having multilayer wiring | Tatsuya Usami, Hidemitsu Aoki, Shinya Yamasaki | 2001-05-01 |