Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337093 | Method of manufacturing semiconductor device | Daisuke Oshida, Ippei Kume, Makoto Ueki, Naoya Inoue, Takuya Maruyama +2 more | 2016-05-10 |
| 8946800 | Semiconductor device with protective layer and method of manufacturing same | Ippei Kume, Kenichiro Hijioka, Naoya Inoue, Hiroyuki Kunishima, Hiroki Shirai | 2015-02-03 |
| 8487305 | Semiconductor device and method of manufacturing the same | Mami Miyasaka | 2013-07-16 |
| 8329584 | Method of manufacturing semiconductor device | Toshiyuki Takewaki, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi, Takuji Onuma +6 more | 2012-12-11 |
| 8158446 | Semiconductor device and method of manufacturing the same | Mami Miyasaka | 2012-04-17 |
| 7955980 | Method of manufacturing semiconductor device | Toshiyuki Takewaki, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi, Takuji Onuma +6 more | 2011-06-07 |
| 7601640 | Method of manfacturing semiconductor device | Toshiyuki Takewaki, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi, Takuji Onuma +6 more | 2009-10-13 |
| 7358609 | Semiconductor device | Toshiyuki Takewaki | 2008-04-15 |
| 7138700 | Semiconductor device with guard ring for preventing water from entering circuit region from outside | Ryuji Tomita, Tetsuya Kurokawa, Takashi Ishigami, Kazuyoshi Ueno, Makoto Sekine | 2006-11-21 |
| 7052994 | Method for manufacturing semiconductor device, and processing system and semiconductor device | Yoshihisa Matsubara, Toshiyuki Takewaki | 2006-05-30 |
| 7019400 | Semiconductor device having multilayer interconnection structure and method for manufacturing the device | Akira Matumoto, Masahiro Komuro | 2006-03-28 |
| 6876064 | Semiconductor device having superior resistance to moisture | Akira Matumoto, Tadashi Fukase, Masahiro Komuro | 2005-04-05 |
| 6861759 | Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same | Yoshihisa Matsubara, Masahiro Komuro, Takahiro Onodera, Norio Okada | 2005-03-01 |
| 6841880 | Semiconductor device and method of fabricating semiconductor device with high CMP uniformity and resistance to loss that occurs in dicing | Akira Matsumoto, Tadashi Fukase | 2005-01-11 |
| 6555911 | Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios | Yoshihisa Matsubara, Toshiyuki Takewaki | 2003-04-29 |
| 6458690 | Method for manufacturing a multilayer interconnection structure | Toshiyuki Takewaki, Yoshihisa Matsubara | 2002-10-01 |
| 6379782 | Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same | Yoshihisa Matsubara, Toshiyuki Takewaki | 2002-04-30 |
| 6376363 | Forming method of copper interconnection and semiconductor wafer with copper interconnection formed thereon | — | 2002-04-23 |
| 6225697 | Semiconductor device and method for manufacturing the same | — | 2001-05-01 |
| 6149730 | Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor | Yoshihisa Matsubara, Kazuhiko Endo | 2000-11-21 |