| 9337093 |
Method of manufacturing semiconductor device |
Daisuke Oshida, Ippei Kume, Makoto Ueki, Naoya Inoue, Takuya Maruyama +2 more |
2016-05-10 |
| 8946800 |
Semiconductor device with protective layer and method of manufacturing same |
Ippei Kume, Kenichiro Hijioka, Naoya Inoue, Hiroyuki Kunishima, Hiroki Shirai |
2015-02-03 |
| 8487305 |
Semiconductor device and method of manufacturing the same |
Mami Miyasaka |
2013-07-16 |
| 8329584 |
Method of manufacturing semiconductor device |
Toshiyuki Takewaki, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi, Takuji Onuma +6 more |
2012-12-11 |
| 8158446 |
Semiconductor device and method of manufacturing the same |
Mami Miyasaka |
2012-04-17 |
| 7955980 |
Method of manufacturing semiconductor device |
Toshiyuki Takewaki, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi, Takuji Onuma +6 more |
2011-06-07 |
| 7601640 |
Method of manfacturing semiconductor device |
Toshiyuki Takewaki, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi, Takuji Onuma +6 more |
2009-10-13 |
| 7358609 |
Semiconductor device |
Toshiyuki Takewaki |
2008-04-15 |
| 7138700 |
Semiconductor device with guard ring for preventing water from entering circuit region from outside |
Ryuji Tomita, Tetsuya Kurokawa, Takashi Ishigami, Kazuyoshi Ueno, Makoto Sekine |
2006-11-21 |
| 7052994 |
Method for manufacturing semiconductor device, and processing system and semiconductor device |
Yoshihisa Matsubara, Toshiyuki Takewaki |
2006-05-30 |
| 7019400 |
Semiconductor device having multilayer interconnection structure and method for manufacturing the device |
Akira Matumoto, Masahiro Komuro |
2006-03-28 |
| 6876064 |
Semiconductor device having superior resistance to moisture |
Akira Matumoto, Tadashi Fukase, Masahiro Komuro |
2005-04-05 |
| 6861759 |
Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same |
Yoshihisa Matsubara, Masahiro Komuro, Takahiro Onodera, Norio Okada |
2005-03-01 |
| 6841880 |
Semiconductor device and method of fabricating semiconductor device with high CMP uniformity and resistance to loss that occurs in dicing |
Akira Matsumoto, Tadashi Fukase |
2005-01-11 |
| 6555911 |
Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios |
Yoshihisa Matsubara, Toshiyuki Takewaki |
2003-04-29 |
| 6458690 |
Method for manufacturing a multilayer interconnection structure |
Toshiyuki Takewaki, Yoshihisa Matsubara |
2002-10-01 |
| 6379782 |
Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same |
Yoshihisa Matsubara, Toshiyuki Takewaki |
2002-04-30 |
| 6376363 |
Forming method of copper interconnection and semiconductor wafer with copper interconnection formed thereon |
— |
2002-04-23 |
| 6225697 |
Semiconductor device and method for manufacturing the same |
— |
2001-05-01 |
| 6149730 |
Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor |
Yoshihisa Matsubara, Kazuhiko Endo |
2000-11-21 |