Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8564015 | Organic light-emitting diode with high color rendering | Yi-Chieh Chou | 2013-10-22 |
| 8564208 | Lighting device with color temperature adjusting functionality | — | 2013-10-22 |
| 8445896 | Organic light-emitting diode device with high color rendering | Chun-Jen Lin | 2013-05-21 |
| 8368061 | Organic light-emitting diode employing mixed host and method for fabricating the same | Sun-Zen Chen, Shiang-Hau Peng, Bo-Shian Wu | 2013-02-05 |
| 8334531 | High-molecule-based organic light-emitting diode and fabrication method thereof | Wei-Ben Wang, Mao-Feng Hsu, Chun-Jang Wang, Yu-Chiao Chung | 2012-12-18 |
| 8237884 | Organic light-emitting diode device with efficiency roll-up property | Yi-Shan Wang | 2012-08-07 |
| 8222806 | Organic light-emitting diode device and manufacturing method thereof | Ming-Hsuan Wu | 2012-07-17 |
| 8216634 | High-molecule-based organic light-emitting diode and fabrication method thereof | Wei-Ben Wang, Mao-Feng Hsu, Chun-Jang Wang, Yu-Chiao Chung | 2012-07-10 |
| 8188490 | Organic light emitting diode and manufacturing method thereof | Kuo-Yen Tsend | 2012-05-29 |
| 7901962 | Method for preparing organic light-emitting diode including two light-emitting layers with two solvents | Pei-Yu Hwang | 2011-03-08 |
| 7453200 | White-light organic light-emitting diode (OLED) and its fabrication method | Ming-Chen Sun | 2008-11-18 |
| 6933522 | Organic electroluminescent device and method for producing the same | Ming-Der Lin, Feng-Ju Chuang, Yen-Shih Huang | 2005-08-23 |
| 6767818 | Method for forming electrically conductive bumps and devices formed | Shyh-Ming Chang, Tai-Hong Chen, Yu-Te HSIEH, Chun-Ming Huang, Jui-Ming Ni +1 more | 2004-07-27 |
| 6762554 | Electroluminescent device with drying film and method for fabricating the same | Min-Der Lin, Yung-Sheng Chiu, Yen-Shih Huang, San-Bao Lin, Feng-Ju Chuang | 2004-07-13 |
| 6537854 | Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed | Shyh-Ming Chang, Chi Yuan Wu | 2003-03-25 |
| 6365500 | Composite bump bonding | Shyh-Ming Chang, Yu-Chi Lee, Dyi-Chung Hu | 2002-04-02 |
| 6084301 | Composite bump structures | Shyh-Ming Chang, Yu-Chi Lee | 2000-07-04 |
| 5707902 | Composite bump structure and methods of fabrication | Shyh-Ming Chang, Yu-Chi Lee | 1998-01-13 |
| 5393697 | Composite bump structure and methods of fabrication | Shyh-Ming Chang, Yu-Chi Lee, Hsiu-Mei Yu, Li-Hui Yang | 1995-02-28 |