Yi-Fu Chung has been granted 13 US patents while listed as an inventor at Mosel Vitelic . The first was granted in 2000 and the most recent in September 2009. Yi-Fu Chung ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Yi-Fu Chung in Tainan, TW.
Patents per Year Patents granted per year, 2000 to 2009 Bar chart with a peak of 3 patents in 2004. peak 3 2000: 2 patents 2000 2002: 1 patents 2002 2004: 3 patents 2004 2006: 2 patents 2006 2007: 2 patents 2007 2008: 2 patents 2008 2009: 1 patents 2009
Issued Patents All Time
Showing 1–13 of 13 patents
Patent # Title Co-Inventors Date
7592240
Method for forming a gate structure through an amorphous silicon layer and applications thereof
Jen-Chieh Chang , Shih-Chi Lai , Tun-Fu Hung
2009-09-22
7432204
Wafer and the manufacturing and reclaiming methods thereof
Jen-Chieh Chang , Pei-Feng Sun
2008-10-07
7375005
Method for reclaiming and reusing wafers
Jen-Chieh Chang , Shih-Chi Lai , Chih-Shin Tsai
2008-05-20
7282429
Method of manufacturing Schottky diode device
Shih-Chi Lai , Pei-Feng Sun , Jen-Chieh Chang
2007-10-16
7211523
Method for forming field oxide
Shih-Chi Lai , Jen-Chieh Chang
2007-05-01
7118971
Method for fabricating trench power device
Jen-Chieh Chang , Tun-Fu Hung
2006-10-10
6991994
Method of forming rounded corner in trench
Pei-Feng Sun , Jen-Chieh Chang
2006-01-31
6828196
Trench filling process for preventing formation of voids in trench
Pei-Feng Sun , Shih-Chi Lai , Mao-Song Tseng
2004-12-07
6709952
Method of forming a bottom oxide layer in a trench
Shih-Chi Lai , Jen-Chieh Chang , Ching-Chiu Chu
2004-03-23
6677216
Method of making IC capacitor
Chun-Pey Cho , Tsai-Sen Lin , Chou-Shin Jou , Chuan-Yi Wang , Jen-Chieh Chang +1 more
2004-01-13
6492248
Few-particle-induced low-pressure TEOS process
Jen-Chieh Chang , Ching-Cheng Hsieh , Pei-Feng Sun
2002-12-10
6117755
Method for planarizing the interface of polysilicon and silicide in a polycide structure
Sung Kun-Yu , Chien-Hung Chen , Kuang-Chao Chen
2000-09-12
6066529
Method for enlarging surface area of a plurality of hemi-spherical grains on the surface of a semiconductor chip
Ping-Wei Lin , Jui-Ping Li , Ming-Kuan Kao
2000-05-23