Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7432204 | Wafer and the manufacturing and reclaiming methods thereof | Jen-Chieh Chang, Yi-Fu Chung | 2008-10-07 |
| 7282429 | Method of manufacturing Schottky diode device | Shih-Chi Lai, Yi-Fu Chung, Jen-Chieh Chang | 2007-10-16 |
| 6991994 | Method of forming rounded corner in trench | Yi-Fu Chung, Jen-Chieh Chang | 2006-01-31 |
| 6828196 | Trench filling process for preventing formation of voids in trench | Shih-Chi Lai, Mao-Song Tseng, Yi-Fu Chung | 2004-12-07 |
| 6492248 | Few-particle-induced low-pressure TEOS process | Jen-Chieh Chang, Yi-Fu Chung, Ching-Cheng Hsieh | 2002-12-10 |
| 6147013 | Method of LPCVD silicon nitride deposition | Ching-Cheng Hsieh, Chien-Hung Chen, May-Jane Chen | 2000-11-14 |