Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7553697 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low +1 more | 2009-06-30 |
| 7485562 | Method of making multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo +2 more | 2009-02-03 |
| 7173330 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low +1 more | 2007-02-06 |
| 7087992 | Multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo +2 more | 2006-08-08 |
| 6987031 | Multiple chip semiconductor package and method of fabricating same | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low +1 more | 2006-01-17 |
| 6964881 | Multi-chip wafer level system packages and methods of forming same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo +2 more | 2005-11-15 |
| 6958537 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low +1 more | 2005-10-25 |
| 6825553 | Multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo +2 more | 2004-11-30 |